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Sarawak’s SMD Semiconductor to provide chip design services to Germany’s X-FAB

Sarawak’s SMD Semiconductor to provide chip design services to Germany’s X-FAB

27 Mar 2023

Sarawak Microelectronics Design  (SMD) Semiconductor Sdn Bhd, a wholly-owned subsidiary of Sarawak Research and Development Council (SRDC), today signed a framework services agreement (FSA) with Germany’s X-FAB Global Services to provide chip design services. 

The agreement was signed by SMD Semiconductor chief executive officer (CEO) Shariman Jamil, its director Dr Peter Morin Nissom, X-FAB Group CEO Rudi de  Winter and group chief technology officer Joerg Doblaski.

The FSA exchange ceremony was witnessed by Sarawak Premier Tan Sri Abang Johari Tun Openg, state Education, Innovation and Talent Development Minister Datuk Roland Sagah Wee Inn and his deputy, Datuk Dr Annuar Rapaee, Sarawak State Financial Secretary Datuk Seri Wan Lizozman Wan Omar and X-FAB Silicon Foundries SE chairman, Tan Sri Hamid Bugo.

Through the agreement, SMD will render chip design to XFAB to develop XFAB’s latest silicon IP libraries for their advanced process technology node migration.

“This activity also aligns with X-FAB’s expansion plan at Samajaya facility in Kuching to increase the foundry output from 30,000 to 40,000 wafers per month by 2025,” SMD Semiconductor said in a statement today.

Meanwhile, Abang Johari, who spoke at the ceremony, said the agreement also signified the Sarawak government’s commitment to gear its industry towards Industrial Revolution 4.0 (IR4.0) and a high-value economy.

He also hoped that Sarawakian semiconductor professionals working overseas would return to contribute to the state’s industry through this initiative.

“SMD’s collaboration withX-FAB Global Services will make Sarawak a major player in the global supply chain and enable higher skilled jobs creations,” he added.

Source: Bernama