Infineon Kulim inks MoU with Germany, Malaysian universities to foster collaboration

Infineon Kulim inks MoU with Germany, Malaysian universities to foster collaboration

15 Nov 2023

Infineon Kulim is extending its strategic collaboration with renowned Germany and Malaysian universities to further enhance efforts in nurturing industry-ready talents for the global semiconductor industry.

Its senior vice president and managing director Ng Kok Tiong said the move would pave the way for all parties involved to explore new possibilities for further cooperation following decade-long collaborations which had reaped benefits for both Malaysia and Germany.

“Over the years, the collaborative parties have ventured into various activities that have helped facilitate student exchanges, industry-academia dialogue, virtual seminars, research matching, international collaboration forums, and various student activities.

“All of these have brought mutual benefits not only to the semiconductor industry and talent pipeline as a whole, but also provided solid insights from the industry that enabled and enhanced a more holistic student learning experience.

“This certainly has played a role in producing industry-ready talents that brought mutual benefit to both country Malaysia and Germany,” Ng said in his speech at the memorandum of understanding (MoU) signing ceremony to extend cooperation with

OTH Regensburg University of Germany and two Malaysian universities yesterday.

The event was opened by the Ministry of Education’s Educational Technology and Resources Division director Zainal Abas, who represented Education Minister Fadhlina Sidek.

Present were deputy head of mission, German Embassy in Kuala Lumpur, Ulrike Wolf, Universiti Tunku Abdul Rahman (UTAR) president Prof Ewe Hong Tat and Universiti Sains Malaysia (USM) Industry and Community Networking Division director Dr Shaizatulaqma Kamalul Ariffin.

Ng represented Infineon Kulim at the ceremony, where he signed an MoU with OTH Regensburg, one of the most research-oriented universities of applied sciences in Germany, in order to continue the 10-year-old collaboration.

OTH Regensburg was represented by its vice president for Research and International Affairs, Prof Dr Oliver Steffens.

During the event, Infineon Kulim also inked an MoU to extend its collaboration with UTRA while OTH Regensburg and USM Engineering Campus signed an MoU to extend their academic cooperation.

Ng added that the event also marked the celebration of the 10 years anniversary of Infineon Kulim cooperation with its partners.

“The OT Regensburg, universities in Malaysia, together with other German companies based in Malaysia have been cooperating very successfully for more than 10 years in the semiconductor industry.

“Together with our cooperation partners, we would like to celebrate this anniversary in Malaysia and explore new possibilities for further cooperation,” he said.

Germany-based Infineon Technologies AG is a global semiconductor leader in power systems and loT, offering game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT.

Kulim Infineon plant located in Kulim High Tech Park (KHTP) is the largest 200mm Front-End manufacturing site for Infineon, focusing on Automotive, Green Industrial Power & Power, and Sensor Systems.

Infineon Kulim is undergoing expansion with the construction of its Kulim wafer fab Kulim 3.

In August, Infineon Technologies AG announced that it was investing 5.0 billion euros (about RM24.9 billion) over the next five years to build the world’s largest 200mm silicon carbide (SiC) power fabrication (power fab) plant in Malaysia.

The company was reported as saying that the investment on its Kulim facility would lead to an annual SiC revenue potential of about 7 billion euros by the end of the decade.

Source: NST