Carsem was established in 1972 and is part of Hong Leong Group, one of the largest conglomerates in Malaysia. Carsem, headquartered in Ipoh-Malaysia, is a leading provider of turnkey packaging and test services to the semiconductor industry. The company has two high-technology factories incorporating sophisticated, "state-of-the-art" equipment, ensuring products meet the quality standards set by the automotive, telecommunication, IT and consumer electronics industries. Carsem is competing on a global level in the semiconductor industry and has customers all over the world. It has expanded multi fold since its inception and has a total workforce of over 6,000 people.

The company has one of the finest technologies in copper clip applications and has partnered with the largest supplier of power management. It also has its own development center with a dedicated operations team to provide better services to the customer. Carsem has established an automation group for micro-electrical-mechanical systems (MEMS) Sensors that has resources for R&D and process development to promote smart manufacturing. It is also partnering with higher learning institutes to focus on projects leading towards predictive Artificial Intelligence (AI) and data exchange in manufacturing technologies that promote factory automation.Through these initiatives, the company primarily hopes to achieve a pioneering data analysis system to enhance production efficiency and service quality.

Malaysia’s strategic location in Asia, highly skilled talent pool, developed infrastructure and tax-friendly policies has created a conducive working environment. MIDA’s role has been instrumental in Carsem’s growth and we are appreciative of the continuous help, incentive/assistance provided by MIDA for the development of new technologies that enable the company to compete globally.


China Shipping Group Company


Last Updated : Thursday 22nd October 2020